最後更新：2026.06.22
Taiwan Semiconductor Manufacturing Company (TSMC) was founded in 1987. It is the world’s first company to provide dedicated wafer manufacturing services (commonly known as wafer foundry) using the most advanced process technology, and it also successfully pioneered the dedicated wafer manufacturing services industry. With steadily growing capital expenditure and performance superior to its peers, TSMC has continued to be the market leader. Through the strong partnerships it has built with each of its customers, TSMC has steadily created powerful growth. IC suppliers around the world entrust their products to TSMC for production because they trust TSMC’s unique, cutting-edge process technology, pioneering design services, manufacturing productivity, and product quality. TSMC serves about 449 customers and produces more than 9,275 different products, which are widely used in diverse application fields such as computer products, communication products, and consumer electronics.
In 2019, TSMC expected to provide an annual capacity of about 12 million 12-inch equivalent wafers, from its fabrication facilities in Taiwan, the United States, and China. It also offers the broadest range of process technologies, fully covering everything from (greater than) 0.5-micron processes to the most advanced process technology, namely today’s 7-nanometer process. TSMC is the first dedicated integrated-circuit manufacturing services company to produce chips for customers using 7-nanometer process technology, and its corporate headquarters is located in Hsinchu, Taiwan.
TSMC is highly insistent on product quality. As early as 2000, TSMC began using MiDFUN’s products, but it was not until 2001, when TSMC began measuring DIE on 8-inch wafers, that it started to make serious use of the measurement software. In 2002, TSMC began measuring the probe-mark area of PID, held itself to inspecting quality assurance, and demanded accuracy and efficiency. MiDFUN Co., Ltd. has worked with TSMC for many years; as TSMC grew rapidly and its products diversified, MiDFUN expanded in step to TSMC’s various plant sites. With its excellent after-sales service and professional automated measurement and SPC functions continually improving to meet the latest international standards, it led TSMC’s supply chain to introduce one company after another, laying a solid foundation for the cooperation between the two parties.
In 2003, MiDFUN built dedicated PID inspection software that not only had to be cross-platform but also had many dedicated functions, such as the ability to use manual fine-tuning or manual measurement when PROVEMARK was unclear, in order to solve the problem of unclear probe marks on the machines. All of these things required MiDFUN Technology to put in several extra weeks of effort, and the new version was finally completed at the end of 2004. After many years of effort, from 2010 onward it was promoted to various related fields in packaging and testing, with continuous refinement and the development of dedicated versions for that industry. In 2019, various suppliers and subsidiaries such as Win Semiconductors, Xintec, ASE, and SPIL successively adopted the MiDFUN system, gaining wide recognition for this system in the semiconductor sector. In 2020, MiDFUN’s AIM-AOI automated inspection system further enabled the semiconductor industry chain to upgrade manual tool microscopes to semi-automated rapid inspection at a relatively low cost, earning recognition from the relevant suppliers. In 2023, a new version of the Worse Chart was also written specifically in response to TSMC’s requirements, enhancing the quality of the relevant supply chain and the introduction of AIQ, a part that likewise earned recognition and praise. We hope to continue providing everyone with professional, exquisite, high-precision, and high-quality systems in the future. Thank you all!!
ASE has adopted MiDFUN Technology’s AIM-FAB system for metallography and wafer microscopes from 2004 to the present (2023).
Win Semiconductors introduced MiDFUN’s MES-AIM-FAB automated measurement and posting system in 2018, and continues to expand it in 2023.
General Taiwan has adopted MiDFUN Technology’s AIM-FAB system from 2014 to the present (2023).
Xintec has adopted MiDFUN Technology’s AIM-FAB system from 2010 to the present (2023).
SPIL has adopted MiDFUN Technology’s AIM-FAB system from 2011 to the present (2023), including Suzhou SPIL and others.
MiDFUN Technology’s AIM-FAB system is the measurement system best suited for DIE/PAD-related products.
